Components, chips, testing, AI, data and digital services
The thematic scope is built around a modern electronics + digital economy stack, with clearly defined sections that match real procurement briefs. On the electronics and manufacturing side, the official hall descriptions include electronic components (passives, distribution, discrete semiconductors, connectors, PCB), integrated circuits (design, processing, packaging/testing, semiconductor equipment/materials, and related chip/application products), test and measurement (electronics/communications instruments, environmental testing, analysis instruments, certification/testing), and smart electronic manufacturing equipment (automation equipment, SMT technologies, soldering materials/equipment, ESD/cleaning solutions, and manufacturing services). On the digital layer, the show positions “data infrastructure” (storage, servers, CPU/GPU, storage chips, supercomputing), software and digital services (cloud, big data, IoT, e-commerce, 5G/6G, and cybersecurity), AI foundation models, and “digital life” application scenarios such as intelligent terminals, smart healthcare/education, AR/VR and digital twin themes, which is valuable for system buyers looking for integrated stacks rather than single components.