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CIOE 2026 Optoelectronics Industry Expo

CIOE 2026

Duration

September 9–11, 2026

Location

Shenzhen

Topic

Electronics and Electrical Engineering

Key facts about CIOE 2026

General information
260,000㎡, 4,000+ exhibitors, 150,000+ visitors
CIOE 2026 positions itself as a full-chain optoelectronics procurement and networking platform, bringing together component suppliers, equipment manufacturers, solution providers, and downstream integrators in one venue and timeframe. The official “facts and figures” for the 2026 edition highlight an exhibition area of 260,000 square meters, 4,000+ exhibitors, and 150,000+ expected professional visitors, supported by around 90 conferences. This scale is designed for high-density B2B sourcing: visitors can compare vendors across multiple technology clusters during a single trip, while exhibitors gain access to OEMs, system houses, and R&D teams looking for photonics-enabled upgrades in telecom, consumer electronics, advanced manufacturing, sensing, and display. The show’s structure also supports targeted matchmaking and time-efficient supplier discovery, which is critical for buyers evaluating alternatives, qualifying new factories, and benchmarking specifications before RFQs and audits.
Themes
Information & communication, optics, lasers, infrared, sensing, display
CIOE is built around concurrent “co-located” expo themes that collectively map the optoelectronics value chain. The official program references eight parallel events covering information and communication, precision optics and camera-related technologies, lasers and intelligent manufacturing, infrared applications, intelligent sensing, photonics innovation, display technologies, and AR & VR. In practical terms, this means buyers can source optical materials and coatings, lenses and modules, laser sources and processing solutions, IR components and systems, sensing stacks (including machine vision-facing ecosystems), and display/AR-related photonics in one consolidated marketplace. For engineering-driven procurement, the format helps evaluate compatibility across the stack—materials to devices to equipment—especially when product performance depends on tight coupling between optics, emitters/detectors, packaging, metrology, and production tooling.
Participants
30+ countries, brands, innovators, and industrial buyers
The event’s positioning emphasizes broad international participation and a strong concentration of China-based manufacturers serving global supply chains. The official overview indicates 3,800+ exhibitors and participation from 30+ countries and regions, which typically translates into a mix of large established brands, specialized component suppliers, equipment vendors, and fast-scaling innovators. On the demand side, CIOE targets professional visitors—procurement, R&D, and product teams who need to validate suppliers, compare technical roadmaps, and identify manufacturable solutions. For B2B visitors, the real value is not only the number of booths but the density of adjacent categories: you can shortlist suppliers, check production readiness, understand lead-times and qualification paths, and then move to structured follow-up (samples, specs alignment, factory audits, and contract terms).
Exhibited products
Components, materials, equipment, and integrated optoelectronic solutions
CIOE frames itself as a one-stop sourcing platform for “materials, components, equipment, and solutions,” which is consistent with its full-chain positioning. In practice, buyers typically encounter optical materials and functional films, lenses and precision optics, modules and subsystems, laser sources and laser-enabled manufacturing solutions, infrared components and applications, sensing technologies, photonics innovation showcases, and display/AR & VR-related stacks. The exhibition’s co-located structure is specifically useful for projects where the bill of materials spans multiple photonics domains—for example, systems that require optics plus sensing plus display, or laser processing lines that require source, optics, control, metrology, and integration services. This breadth supports both early-stage technology scouting and late-stage procurement when the priority shifts to vendor qualification, cost structure, and supply continuity.
Venue
Shenzhen World Exhibition & Convention Center (Bao’an)
CIOE 2026 is scheduled at Shenzhen World Exhibition & Convention Center, one of Shenzhen’s primary large-scale venues for international industrial exhibitions. The official traffic guidance specifies the venue address as No.1 Zhancheng Road, Fuhai Street, Bao’an District, Shenzhen, Guangdong, China, which is an important detail for logistics planning, hotel selection, and scheduling transfers between the airport, railway stations, and the fairground. For visiting teams, Bao’an location often means planning around peak-hour congestion and prioritizing time buffers for badge pickup, hall navigation, and meetings across a large footprint. In procurement-focused trips, this venue scale also supports structured routing: allocating halls by technology track and pre-booking meetings to avoid “random walk” browsing that dilutes sourcing productivity.
Organizer
Shenzhen UBM Herong Exhibition Co., Ltd.
The official CIOE contact information lists Shenzhen UBM Herong Exhibition Co., Ltd. as the organizer entity, with dedicated contacts for booth application, visitor delegations, VIP buyers, conferences, and media cooperation. For exhibitors, this is the operational counterparty for contracts, exhibitor manuals, and on-site rules; for visitors, it is the reference point for registration workflows and any official buyer or delegation programs. When planning B2B participation, using the organizer’s official channels reduces risk around counterfeit passes, unofficial agents, or outdated floor plans, and it helps align expectations on dates, venue, and the show’s current-year scope.
Organizer’s website
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