ELEXCON 2025 — Innovation in Electronics, Embedded Systems & AIoT

500+ exhibitors, 50,000 sqm of exhibits, over 20,000 professionals from 30+ countries

ELEXCON 2025 will be held from August 26 to 28, 2025, at the Shenzhen Convention & Exhibition Center (Futian District). The exhibition will cover more than 50,000 square meters and feature over 500 exhibitors from across China, Asia-Pacific, Europe, and North America. Professional visitors will include electronics engineers, embedded system designers, procurement specialists, startup founders, CTOs, R&D heads, and institutional buyers. The venue will be divided into several zones: embedded processing, AIoT, power electronics, smart modules, and innovation startups. Key highlights include live demos, application showcases, reverse pitch meetings, and RISC-V developer forums. The show also includes an online B2B matchmaking system for domestic and overseas attendees, allowing for pre-scheduled meetings with suppliers based on technology profiles.

Semiconductors, embedded systems, AIoT, SiP, SoC, edge computing, power devices, development tools

ELEXCON 2025 will spotlight core technology areas driving the electronics industry forward. These include microcontrollers, real-time operating systems (RTOS), embedded boards, low-power SoCs, and application processors used in everything from smart appliances to robotics and wearables. The AIoT zone will highlight smart modules with onboard AI capabilities, computer vision kits, audio processing, cloud connectivity, and ultra-low latency edge computing architectures. Power electronics will feature gallium nitride (GaN), silicon carbide (SiC) devices, power conversion modules, BMS chips, and automotive-grade solutions. The exhibition will also cover next-gen SiP (System-in-Package) integration, high-speed interconnects, 3D packaging, thermal management, and signal integrity tools. Developer tools — such as emulators, IDEs, compilers, CI/CD integration, and design automation software — will be showcased. These are supported by industry leaders in debugging, hardware acceleration, and digital twin environments. Visitors can experience interactive labs and hands-on sessions that explore the entire development cycle, from concept to testing and deployment in real-world applications.

Chipmakers, embedded developers, OEM/ODM manufacturers, component distributors, IoT solution providers

Exhibitors at ELEXCON 2025 will include international semiconductor manufacturers (STMicroelectronics, Renesas, Infineon, NXP, Texas Instruments), Chinese innovators (Espressif, Rockchip, Allwinner, GigaDevice), contract manufacturers, hardware prototyping services, open-source hardware vendors, and leading IoT platform providers. Also participating are software solution companies, RISC-V Foundation members, wireless module developers, power management experts, and edge infrastructure players. Visitors will meet OEM procurement teams, R&D engineers, design houses, university research labs, and early-stage product teams looking for smart modules and chipset options. Many fast-growing startups will present their AI-capable devices, secure MCU lines, and modular connectivity stacks. The event fosters industry-academic collaboration and early access to emerging technologies through incubator and venture capital partnerships.

Microcontrollers, SoCs, embedded platforms, wireless modules, power ICs, development kits, sensors, boards, simulation tools

The product scope includes embedded processors (RISC-V, ARM Cortex-M, proprietary architectures), SoCs with integrated AI/NPU, wireless communication modules (Wi-Fi 6, Bluetooth 5.3, NB-IoT, LoRa, Zigbee), RF front-ends, smart transceivers, advanced sensing (IMUs, time-of-flight, voice activation), and analog front-end ICs. Power management components cover voltage regulators, switching controllers, digital power supplies, GaN/SiC-based devices, and compact modules for battery-powered systems. Development tools include IDEs, debuggers, emulators, rapid prototyping boards (STM32, ESP32, Raspberry Pi), FPGA development kits, and virtual simulation environments. Many products focus on high integration, thermal optimization, compact form factor, and compliance with automotive, industrial, and medical-grade standards. Application demos will show use cases in smart factories, home automation, wearable tech, smart logistics, and autonomous systems. Attendees can interact with live displays and access developer resources and SDKs on-site.

Shenzhen Convention & Exhibition Center (Futian District)

The event is held at Shenzhen’s central venue in Futian, a modern convention complex with integrated logistics, customs clearance, tech demo zones, and fast transport links to major industrial zones and Shenzhen airport.

Bowen Creative Exhibition (Shenzhen) Co., Ltd.

ELEXCON is organized by Bowen Creative, a specialist in electronics and IT industry trade events in China. With over a decade of experience, they partner with regional development zones, global electronics alliances, and government agencies to deliver high-level B2B exhibitions and tech forums.

Organizer’s website

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