ELEXCON 2026 electronics expo

ELEXCON Shenzhen 2026 is announced as the 23rd Shenzhen International Electronics Exhibition & Embedded Expo and is positioned as a large-scale professional marketplace for electronics, embedded systems and applied engineering solutions. The 2026 edition runs on September 9–11 at Shenzhen World Exhibition & Convention Center (Bao’an), offering a compact three-day window optimized for supplier screening, technical evaluation and business negotiation. The official event framing emphasizes scale and density, with a combined show footprint presented at 340,000 m², alongside 240,000+ professional visitors, 5,000+ exhibitors and 100+ concurrent forums, which signals a high probability of meeting decision-makers and comparing competing solution routes in one trip. A key structural feature is the co-located, “three-show linkage” format alongside major optoelectronics and integrated circuit events, designed to connect component supply, embedded computing and system-level applications under one integrated ecosystem.

ELEXCON 2026 is presented under the theme “All for AI, All for GREEN,” framing the show around two intertwined demand drivers: edge AI adoption and energy-efficient, sustainable electronics design. In practical terms, this positions the exhibition toward solutions that can be implemented in real products and infrastructure, rather than concept-only demonstrations. The agenda is engineered to support engineering-led procurement, where buyers must validate performance, reliability and integration complexity across complete stacks, from chips and memory to embedded modules, power devices and connectivity. By anchoring the show in AI and green applications, ELEXCON aligns exhibitors and visitors around concrete use cases such as intelligent terminals, industrial automation, automotive electronics, data-centric infrastructure and smart sensing, where total cost of ownership, lifecycle reliability and supply continuity determine purchasing outcomes.

The visitor profile is positioned to cover multiple electronics demand sectors, including consumer electronics, automotive, communications, data centers, medical electronics, industrial control and IoT-related applications, reflecting Shenzhen’s role as a manufacturing and innovation hub for hardware products. This mix creates a practical meeting environment: engineering teams can validate technical fit and roadmaps, procurement teams can benchmark commercial terms and lead times, and integrators can align on deployment requirements and service support. The published scale indicators suggest a high-density participation model where exhibitors can reach both direct OEM/ODM demand and channel partners, while visitors can compare multiple suppliers across core categories without fragmenting sourcing across several separate events.

ELEXCON’s scope is presented as full-stack electronics and embedded coverage, with emphasis on embedded AI and edge computing platforms such as MCU, MPU, SoC, FPGA and DSP, alongside embedded modules, development boards, operating systems and debugging and simulation tools. The show positioning also highlights semiconductor and component categories that drive real product delivery, including IC, SoC, MCU and MPU, power supplies and power semiconductors, testing and measurement, high-speed interconnect and connectors, harness and cabling components, relays and switches, and passive devices. Additional focus areas include MEMS and sensors, storage, PCB and electronics manufacturing services, automotive electronics, optoelectronics and display technologies, and SiP and advanced packaging, enabling visitors to build an end-to-end supplier map from design to scalable production.

The event is scheduled at Shenzhen World Exhibition & Convention Center in Bao’an District, a venue suited to large-scale, multi-hall trade shows that require dense visitor circulation and meeting capacity. For professional attendees, the venue choice supports a procurement-first workflow: teams can pre-plan supplier meetings, allocate blocks for technical demos and forum attendance, and use the three-day window to complete initial shortlists and negotiation alignment. Bao’an’s location also supports operational convenience for manufacturing-linked teams and supply chain partners who work across the Greater Bay Area, making it feasible to combine the exhibition visit with factory meetings, partner briefings and follow-up technical sessions during the same trip.

The event’s official positioning emphasizes a “three-show linkage” mechanism that connects electronics and embedded technologies with optoelectronics and integrated circuit innovation events, creating a broader ecosystem that supports new technology launches and commercialization. This model is reinforced by the announced 100+ concurrent forums, which typically improves decision support by adding trend interpretation, technical exchange and solution validation beyond booth-level discussions. For exhibitors, this structure increases qualified lead density and supports both technology marketing and partner acquisition. For buyers and engineers, it provides a time-efficient environment to compare roadmaps, validate integration assumptions and identify suppliers capable of supporting stable delivery and long-term service commitments.