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IICIE 2026 semiconductor expo

IICIE 2026

Duration

September 9–11, 2026

Location

Shenzhen

Topic

Electronics and Electrical Engineering

Key facts about IICIE 2026

General information
60,000 m², 1,100+ exhibitors, 60,000+ visitors
International Integrated Circuit Innovation Expo, or IICIE 2026, is the upgraded format of the former Shenzhen International Semiconductor & IC Exhibition (SEMI-e). The official site positions it as a high-end platform for the entire semiconductor industry chain, focused on cross-industry integration and full-chain collaboration. For the 2026 edition, the organizer publishes projected figures of 60,000 square meters of exhibition area, more than 1,100 exhibitors, more than 60,000 professional visitors and over 20 conferences.
Themes
Chips, fabrication, packaging and semiconductor ecosystem
The exhibition covers the full semiconductor ecosystem, including IC products and applications, wafer manufacturing, packaging and testing, semiconductor equipment, semiconductor materials and key components. The official materials also emphasize direct interaction with core industry players such as IDM, Fabless, Fab and OSAT companies, while highlighting demand from AI, consumer electronics, automotive, communications, computing, display, optoelectronics and new energy sectors.
Participants
Chip makers, fabs, OSATs, buyers and engineering teams
IICIE is oriented toward professional B2B audiences across the semiconductor value chain. Based on the official description, the event is designed for companies and specialists involved in chip design, manufacturing, packaging, testing, equipment, materials and industrial applications. Its positioning around direct engagement with key decision-makers makes it relevant for semiconductor manufacturers, equipment suppliers, materials vendors, procurement teams, R&D specialists and industrial buyers evaluating new technologies and supply-chain partners.
Exhibited products
Chips, EDA, fabrication tools and power semiconductors
The official exhibitor profile lists chip categories such as AI chips, communication chips, memory chips, CPU chips, sensor chips, analog and digital chips, RF chips and power-management chips. It also includes IP and EDA, fabless and foundry services, OSAT, semiconductor equipment, substrate and packaging materials, semiconductor core parts, as well as wide-bandgap semiconductor and power-device technologies including SiC and GaN. This makes the expo relevant both for upstream component sourcing and for companies searching for manufacturing and packaging solutions.
Venue
Shenzhen World Exhibition and Convention Center
IICIE 2026 will take place at Shenzhen World Exhibition and Convention Center in Shenzhen, China, from September 9 to 11, 2026. The official co-located event page confirms the dates and venue, while the event overview page repeats the same location data. The exhibition will run concurrently with CIOE 2026, creating a combined 320,000-square-meter showcase for the optoelectronics and semiconductor industries.
Organizer
Informa-linked exhibition platform in Shenzhen
The official site uses Informa contacts for visa and event communication, and the copyright/footer on the co-located event page names Shenzhen Zhongxincai Exhibition Co., Ltd. The project is presented as an internationally positioned semiconductor exhibition platform with strong integration into the wider CIOE ecosystem, which reinforces its role as a major professional event for the semiconductor and integrated-circuit industries in Shenzhen.
Organizer’s website
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