NEPCON China 2025: Shaping the Future of Electronics Manufacturing
Key Details of NEPCON China 2025
General Information
500+ brands, 38,000+ visits
Held since 2001, NEPCON is China’s top exhibition for electronics production. 2025 covers 45,000 sqm and includes IC Packaging Fair for advanced semiconductor applications.
Themes
SMT, Semiconductors, Automation
Surface mount technology (SMT), testing, soldering, assembly, robotics, sensors, vision systems, IC packaging, automation software and industrial data platforms.
Participants
Global electronics ecosystem
Manufacturers, system integrators, automation experts, engineers, chip developers, PCB producers and industrial IoT suppliers.
Products on Display
Complete electronics assembly chain
Pick-and-place machines, soldering, AOI, SPI, feeders, PCB testing tools, motion control, robotic arms, conveyors, smart packaging, IC encapsulation systems.
Venue
Shanghai World Expo Exhibition & Convention Center
Strategically located venue for high-tech expos, offering modern infrastructure, downtown access and premium services.