Duration
November 25–27, 2025
Location
Shanghai
Topic
Packaging and Containers
General Information
November 25–27, 2025 | Shanghai New International Expo Centre (SNIEC)
A modern, large-scale venue located in Pudong, offering 200,000 m² of exhibition space and advanced infrastructure for global exhibitions.
Themes
Packaging materials, processing, automation, intelligent packaging, sustainability, co-packing, labeling
swop covers all aspects of packaging technology — from materials to complete systems, highlighting both traditional solutions and innovations.
Participants
Packaging manufacturers, material suppliers, machinery vendors, solution providers, brand owners, R&D teams
Exhibitors and visitors span the entire supply chain — from raw material producers to packaging designers and retail brands.
Exhibits
Packaging machinery, recyclable materials, food and pharma packaging, labeling equipment, inspection systems, automation tools
Visitors will find innovations for both primary and secondary packaging, sustainable alternatives, and digital processing technologies.
Venue
Shanghai New International Expo Centre (SNIEC)
A top-tier Asian exhibition hub with excellent transport links, international support services, and state-of-the-art facilities.
Organizer
Messe Düsseldorf Shanghai Co., Ltd., Adsale Exhibition Services Ltd.
Leading exhibition organizers in China and internationally, known for professional trade fairs in the packaging and processing sectors.
Organizer’s website